Go to GlobalSpec.com Home
Free Registration 
GlobalSpec Home
Find:      Advanced >>

We found these Patents Results for: Encapsulants And Potting Compounds
  Engineering Patents: 1 - 2 of 2  
The
Engineering Web®
Products & Services Part Number Search Engineering News Application Notes Material Properties Patents Standards

Epoxy resins prepared from trisphenols and dicyclopentadiene
These new epoxy resins are useful in the electronics industry as encapsulants, potting com-pounds, laminates and the like. View Patent Detail from MicroPatent
Epoxy resins prepared from trisphenols and dicyclopentadiene
These new epoxy resins are useful in the electronics industry as encapsulants, potting compounds, laminates and the like. View Patent Detail from MicroPatent



Home   |   About GlobalSpec   |   Advertise With Us   |   Site Map   |   Top Categories   |   Terms of Use
Privacy Policy   |   Link To Our Site   |   Submit a Site   |   Recommend This Site
©1999-2008 GlobalSpec.  All rights reserved.  GlobalSpec, the GlobalSpec logo, SpecSearch, The Engineering Search Engine and The Engineering
Web are registered trademarks of GlobalSpec, Inc. The Engineering Toolbar and DesignInfo are service marks of GlobalSpec, Inc.
No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used
without the express written permission of GlobalSpec Inc.   350 Jordan Rd, Troy, NY, 12180